EDUCATION
09/2003-06/2009 Ph.D. in Materials Science and
Engineering,
University of Texas at Arlington, Arlington, TX
Supervisor: Dr. J. P. Liu, Professor, Department of Physics.
Dissertation:
“Synthesis, Characterization and Potential Applications of FePt Nanoparticles”
07/1998-06/2003 B.Tech.,
M.Tech. in Metallurgical
Engineering and Materials Science
Indian Institute of Technology (I.I.T.) Bombay, India
Supervisor: Dr. T. R. Rama Mohan, Professor, Materials
Science & Engineering.
Thesis: “Synthesis of Ultrafine Ti Powders by Chemical
Solution Processing”
ACADEMIC EXPERIENCE
02/2007–05/2007 Research Associate, Georgia
Institute of Technology, Atlanta,
GA
Supervisor: Dr. Z. L. Wang, Regents Professor, Materials
Science & Engineering.
High
resolution transmission electron microscopy (HRTEM) analysis training was obtained
and detailed structural characterization analysis on magnetic nanoparticles and
nanocomposites were performed.
09/2005–09/2005 Visitor, National High Magnetic
Field Laboratory, Tallahassee,
FL
Supervisor: Dr. B. Brandt, Director, DC field facility.
High
field alignment experiment of ferromagnetic FePt nanoparticles was executed under
the magnetic field as high as 32 T over the period of one week.
09/2003-06/2009
Research
Assistant, University of Texas at Arlington, Arlington, TX
Supervisor: Dr. J. P. Liu, Professor, Department of Physics.
A
chemical solution route to synthesize hard (FePt, CoPt) and soft (Fe3O4,
CoFe2O4, Fe, Co, FeCo) ferromagnetic nanoparticles and
nanocomposites with controlled morphology was developed. These nanoparticles
were characterized by HRTEM, TEM, SEM, XRD, EDX, UV-vis, AGM and SQUID.
07/2002-6/2003 Teaching Assistant, Indian
Institute of Technology (I.I.T.) Bombay,
India
Supervisor: Dr. N. K. Khosla, Professor, Metallurgical
Engineering and Materials Science.
Lab
projects for undergraduate ‘Instrumentation and Process Controls’ laboratory
were instructed.
INDUSTRY EXPERIENCE
02/2008-01/2009 Co-op, Texas Instruments Inc., Dallas, TX
Supervisor:
Dr. K. Zeng, Packaging Engineer, Semiconductor Packaging Research Group.
Different
electrically conductive die attach materials were investigated as a z-axis
interconnect for 3D semiconductor packages.
Study included electrical resistance measurements, microstructure
characterization, and reliability stressing to assess adhesion with different
interfaces.
05/2000-06/2000 Practical Trainee, Hindustan
Zinc Limited, Udaipur, India
Smelting
process using hydrometallurgical process route was studied with main product as
zinc, cadmium, and sulfuric acid as by products.
PROFESSIONAL SOCIETY MEMBERSHIP
·
Materials Research Society : 07/2006 – Present
·
American Physical Society : 02/2005 – Present
·
The National Scholars Honor Society : 06/2004 –
Present
·
American Society of Metals : 10/2003 – 09/2005